Polymer thick film inks
In-Mold Electronics

Ag Paste 550 EI is a silver-based composition designed to offer a thermoformable conductor capable of withstanding thermoforming and overmolding temperatures. The primary applications include 3D circuits for HMI devices.

Ag Paste 555 EI is a highly conductive silver-based composition designed to offer a thermoformable conductor capable of withstanding thermoforming and overmolding temperatures. The primary application is in 3D circuits for HMI devices.

D 250 EI is a screen-printable composition for insulating conductive tracks. It can be overprinted on conductor or resistive substrates then molded to produce 3D shapes.

Ag Paste 850 EI is a carbon and graphite-based composition designed to produce thermoformable resistors capable of withstanding thermoforming and overmolding temperatures. The primary application is in 3D circuits for HMI devices.