Ag 900 EI is a silver-based thermosetting ink composition formulated to provide a screen printable conductor for PCB and other rigid substrates (epoxy paper, phenoxy paper, glass and metal). It enables screen printing for bus bars for heating elements, jumpers and conductive tracks. It is particularly recommended for through-hole applications and to coat the leads of tantalum capacitors. Ag 900 EI can be thinned with 0205 IT for spraying in EMI/RFI applications.

Ag 902 EI is a conductive monocomponent epoxy adhesive that provides superior bond strength for mounting electronic components on printed circuits. It is designed for bonding surface-mount devices to flexible or rigid printed circuits. It is supplied ready to use and can be applied by screen printing, stencil or dot dispensing. For maximum reliability, we recommend encapsulating Ag 902 EI and its component with the UV transparent composition D 110 EI.

Ag 910 EI is a conductive monocomponent epoxy adhesive that provides superior bond strength for mounting electronic components on printed circuits. It is designed for bonding surface-mount devices to flexible or rigid printed circuits. It is supplied ready to use and can be applied by screen printing, stencil or dot dispensing. For maximum reliability, we recommend encapsulating Ag 910 EI and its component with the UV transparent composition D 110 EI.

Silver inks for rigid substrates (PCB) and cold soldering solutions

Silver inks for rigid substrates (PCB) and cold soldering solutions