Silver-filled Epoxy Compositions


Request a free sample or the technical sheet of our products.

Products

Thermoset PTF
  • Ag PASTE 900 EI
    Ag 900 EI is a silver-based thermosetting ink composition formulated to provide a screen printable conductor for PCB and other rigid substrates (epoxy paper, phenoxy paper, glass and metal). It enables screen printing for bus bars for heating elements, jumpers and conductive tracks. It is particularly recommended for through-hole applications and to coat the leads of tantalum capacitors. Ag 900 EI can be thinned with 0205 IT for spraying in EMI/RFI applications.
    Monocomponent
  • Ag PASTE 902 EI
    Ag 902 EI is a conductive monocomponent epoxy adhesive that provides superior bond strength for mounting electronic components on printed circuits. It is designed for bonding surface-mount devices to flexible or rigid printed circuits. It is supplied ready to use and can be applied by screen printing, stencil or dot dispensing. For maximum reliability, we recommend encapsulating Ag 902 EI and its component with the UV transparent composition D 110 EI.
    Monocomponent
  • Ag PASTE 910 EI
    Ag 910 EI is a conductive monocomponent epoxy adhesive that provides superior bond strength for mounting electronic components on printed circuits. It is designed for bonding surface-mount devices to flexible or rigid printed circuits. It is supplied ready to use and can be applied by screen printing, stencil or dot dispensing. For maximum reliability, we recommend encapsulating Ag 910 EI and its component with the UV transparent composition D 110 EI.
    Monocomponent
  • THINNER 0200 IT
    Silver inks for rigid substrates (PCB) and cold soldering solutions
    Thinner for Ag 910 EI
  • THINNER 0205IT
    Silver inks for rigid substrates (PCB) and cold soldering solutions
    Thinner for Ag 650 EI, Ag 670 EI, Ag 90X EI

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